Category	Description	Capability
Laminate Material	FR4, High TG FR4(tg150,tg170,tg180) Halogen-free FR4, CEM1, CEM3,Polyimide, Rogers ,Aluminum	We will order other special material accoprding to your request
Board Layers	Maximum layers	1-18layers
Size	Maximum finished dimensions	500*1200mm
Board Thickness	Minimum and Maximum	0.2-3.2mm
Copper	Outer copper weight	0.5oz (17um) - 4oz (140um)
Copper	Inner copper weight	0.5oz (17um) - 4 oz (105um)
Drilling	Minimum drilling size	0.15mm
	Drill Deviation (True position size)	2mil (0.050mm)
	PTH hole tolerance	3mil (0.075mm)
	N-PTH hole tolerance	2mil (0.050mm)
	Minimum hole wall thickness	20um
	Angle of Countersink	80°, 90°, 100°, 120°
Circuit line	Minimum width	0.1mm/ 4mil
Circuit line	Minimum space	0.1mm/ 4mil
Inner Layers	Minimum space from drilling to inner pattern	6mil (0.15mm)
	Minimum space from annular ring to inner pattern	6mil (0.15mm)
	Layer-to-layer registration	3mil (0.08mm)
Board Profilling	Hole to board edge tolerance	±4mil (0.1mm)
	Pattern to board edge tolerance	±4mil (0.1mm)
	CNC Tolerance	±4mil (0.1mm)
	Minmum thickness after V-Cut	12mil (0.3mm)
	V-Cut tolerance	±5mil (0.12mm)
	V-Cut Angle	20,30,45,60
Solder mask	Color	green, light green, matte green, white black,matte black,yellow,red, blue
Solder mask	Thickness	≥17um
Silkscreen	Color	White, black, yellow, red, blue, green, gray
	Minimum line height	≥0.0625mm
	Minimum line width	≥0.125mm
Surface Finish	HASL, HASL pb free, immersion gold, immersion silver, O.S.P
Certification	IPC-A-600 Class II/III, UL E324220, ISO 9001,ISO/TS16949, ROHS

The advantages of using metal backed PCBs and LED PCB boards:

Power densities can be increased whilst components are kept cool, increasing life and durability.
Surface mount technology can remove manual assembly from the traditional heat sink, clip, sil-pad arrangement.
Dielectrics can be tailored to suit your thermal or insulation level requirements.
The circuits can be shaped, drilled and formed, an advantage when compared to ceramic based products.
Cooling properties allow devices to be driven harder or de-rated for lower cost components.