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0.25MM Immersion Gold High Frequency PCB Design 12 Layer PCB Board 4 Mil

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Global Success Circuits Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrsRose Guo
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0.25MM Immersion Gold High Frequency PCB Design 12 Layer PCB Board 4 Mil

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Brand Name :Global Success Circuits Co.,Ltd
Model Number :GSC-P1A3DE
Certification :UL(E324220) TS16949 ISO 9001
Place of Origin :China (mainland)
MOQ :1 Piece
Price :US$ 0.1 - 5 / Piece
Payment Terms :T/T, D/P, D/A, L/C, Western Union
Supply Ability :100,000㎡/Month
Delivery Time :5 - 15 days
Packaging Details :Vacuum Packing and High Quality Carton Box
Layers :12L
Thickness :2.0mm
Min hole size :0.25MM
Min Line Width/Space :4 mil
Surface finish :ENIG
Product use: :Micro base station
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0.25MM Immersion Gold High Frequency PCB Design 12 Layer PCB Board 4 Mil

Here at Global Succes, Standard PCB service refers to full feature printed circuit board manufacturing service. With 13 years' experience in PCB fabrication, we have handled hundreds of thousands of PCB projects, and covered almost all kinds of substrate material including Standard FR4, Aluminum, Rogers, etc. This page only touches standard FR4 based PCB. For PCBs with special technical substrate, please kindly refer to corresponding webpage for information.

Unlike Prototype PCB service, our Standard PCB service has tighter production tolerances.

If you have any question or concern on our Custom PCB capabilities or your demanded custom circuit spec is not included in the above table, please feel free to contact us.We're always available for you.

It is recommended to use Standard PCB service when your design is ready to transform from prototype phase to production phase. We can manufacture up to 10 million pieces high quality PCBs with very competitive prices. To endow your project with expected function and more possibilities, we offer advanced features for Standard PCB services. Comprehensive capabilities can be found in the following table:

PCB manufacturing capability - Item

Production

Prototype

Max Layer Count

2-14 Layers

2-16 Layers

Max Board Thickness

0.175”

0.200”

Max Board Size

26"×26")

26"×26")

Min Board Thickness

0.014”

0.012”

Min Track Width/Gap, Outer/Inner (17 micron)

0.003” / 0.003”

0.003” / 0.003”

Min Hole Size

0.006”

0.006”

Min Annular Ring (outer layer)

0.003”

0.003”

Min Annular Ring (inner layer)

0.004”

0.004”

Drill to Metal

0.008”

0.007”

Drilling Tolerance(PTH&NPTH)

+/- 0.002”

+/- 0.002”

Hole Position Tolerance

+/- 0.003”

+/- 0.002”

Min Solder mask Registration

0.001”

0.001”

Board Thickness(<1.0mm) Tolerance

+/-0.004"

+/-0.004"

Board Thickness(>1.0mm) Tolerance

+/-10%

+/-10%

Inner Layer Registration

+/- 0.004”

+/- 0.004”

Outline Routed Tolerance

+/- 0.004”

+/- 0.004”

Outline Scored Tolerance

+/- 0.008”

+/- 0.008”

Aspect Ratio

</= 8:1

</= 12:1

Min QFP Pitch (not HASL)

0.016”

0.010”

Controlled Impedance(Single ended)
Controlled Impedance( Differential )

50 - 90 ohms +/- 6%
100 - 155 ohms +/- 10%

50 - 90 ohms +/- 7%
100 - 155 ohms +/- 8%

Max Internal Copper Wt.

6 oz

7 oz

HDI(1+N+1 Max Layer Count)-Min Via Size
- Min Capture Pad Size

0.004”
0.012”

0.004”
0.012”

Surface Finish Selection:

Surface finish treatment

Production

Prototype

Liquid Photo-Imageable Solder Mask (LPI)

10-40um

10-40um

Peelable Solder Mask

0.2-0.5mm

0.2-0.5mm

Conductive Carbon Ink

≤20Ω

≤20Ω

Hot Air Solder Leveled Finish (HASL) /HAL Lead Free

1-30um

1-30um

Organic Solderability Preservatives(OSP)

Entek Cu 106A HT , Preflux F2 LX
Thickness 0.2-0.6um

Entek Cu 106A HT, Preflux F2 LX
Thickness 0.2-0.6um

Electroless Immersion Gold

Ni: 2.0-10um Au: 0.025-0.10um

Ni: 2.0-10um Au: 0.025-0.10um

Electrolytic Flash Gold

Ni: 2.5-10um Au: 0.020-0.075um

Ni: 2.5-10um Au: 0.020-0.075um

Electroless Immersion Silver

0.10-0.5um

0.10-0.5um

Electroless Immersion Tin

0.3-2.0um

0.3-2.0um

Gold tab/finger plating(3u"-60u")

Ni: 2.5-10um Au: 0.25-1.50um

Ni: 2.5-10um Au: 0.25-1.50um

Selective Surface Treatment

ENIG+OSP, ENIG+G/F, Flash Gold+HAL, Flash Gold+G/F,Immersion Silver+G/F, Immersion Tin+G/F

Special Materials Selection:

High Performance Materials

Production

Prototype

Al / Cu Substrate

Yes

Yes

Bismalemide Triazine
(BT) or equivalent

Yes

Yes

Nelco N 4000 - 13

Yes

Yes

Nelco N 4000 - 13 (SI)

Yes

Yes

Nelco N 4000 - 12

Yes

Yes

Rogers RO4350

Yes

Yes

Rogers RO4003

Yes

Yes

Rogers RO4233

Yes

Yes

Taconic RF-35

Yes

Yes

Taconic RF-45

Yes

Yes

Taconic TLX-8

Yes

Yes

Arlon AD250

Yes

Yes

Arlon AD320

Yes

Yes

Arlon IsoClad917

Yes

Yes

Isola FR408

Yes

Yes

Isola 370HR

Yes

Yes

Isola 406HR

Yes

Yes

Getek / Megtron

Yes

Yes

Polyclad PCL-FR370HR

Yes

Yes

Hitachi MCL-BE-67G

Yes

Yes

Halogen Free

Yes

Yes

Other Normal Materials:

Normal Material

Production

Prototype

Solder Mask Material

Taiyo or Tumura

Taiyo or Tumura

Laminate Material

Shengyi
(S1130,S1141,S1141,S1150,
S1170)

ITEQ (IT140,IT150,IT-140G,ANTI-CAF,IT155G,IT180)

Nanya , Goword (GW40,GW4011

KB (KB-7150CEM,KB-6167,KB-6165,KB-6162,KB-6160/6160C,KB6165/6160)

Shengyi
(S1130,S1141,S1141,S1150,
S1170)

ITEQ (IT140,IT150,IT-140G,ANTI-CAF,IT155G,IT180)

Nanya , Goword (GW40,GW4011

KB (KB-7150CEM,KB-6167,KB-6165,KB-6162,KB-6160/6160C,KB6165/6160)

HASL Lead Free

SN100C

SN100C

Peelable Mask

SD2955

SD2955

PCB manufacturing Lead Time:

Layer Count

Quick-turn Prototype

Mass Production

2 Layers

24 Hours

12 Working Days

4 Layers

48 Hours

13 Working Days

6 Layers

72 Hours

14 Working Days

8 Layers

96 Hours

14 Working Days

10 Layers

140 Hours

16 Working Days

12 Layers

160 Hours

17 Working Days

14 Layers

180 Hours

20 Working Days

16-20 Layers

Specified case by case

More than 20 Layers

Specified case by case

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