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1Oz - 4Oz Rogers Circuit Board Immersion Gold Green Solder Mask 1.6mm Thickness
Rogers PCB are hydrocarbon ceramic laminates and prepares offer superior high frequency performance and low cost printed circuit fabrication resulting in a low loss material which can be fabricated using standard epoxy/glass (FR-4) processes. Rogers material is also referred as RO4000. It is used in PCB designs where power management, signal integrity and impedance matching is very crucial. Most common application, where Rogers Material is used are: high-speed designs, RF, microwave, mobile applications, etc
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Rogers PCB used dielectric material which is poor conductor of electricity. It is used as insulating layer on regular FR-4 based PCB. Some examples of di-electric are Porcelain, mica, glass, plastics and some metal oxides are good dielectrics.
We have 3 PCB factory to ensure the lead-time. We also strictly control the quality according to international quality control system standard. We believe we can be your good partner in future. Please check below information about our factories and enclosed certifications for you reference.
Factory | Established time | Target market | Productivity/Each month | Staff | Lead time | Raw material |
Shenzhen | 2005 | Prototype,small and medium-sized volume | > 20,000 sqm | 300 people | Prototype:3-5days; Medium-sized: 7-10days | SY,KB,ILM,Isola,Rogers |
Jiangxi | 2010 | Normal FR4 & Aluminum mass production | > 40,000 sqm | 400 people | 8-16days | |
Jiangsu | 2014 | Automotive, Aerospace & Smart Metering mass production | > 60,000 sqm | 500 people | 10-20days |
CAPABILITIES
Items | Mass Production | Sample |
Max.Layer Count | 16 Layers | 14 Layers |
Max.Panel Size | 27.5″x24″ | 27.5″x24″ |
Max.Board Thickness | 3.5mm | 5.8mm |
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Min.Trace Width/Spacing |
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Outer Layer | 3.5/3.5mils | 3/3mils |
Inner Layer | 3.5/3.5mils | 3/3mils |
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Min.Board Thickness | 2L:6mils | 2L:6mils |
| 4L:15mils | 4L:15mils |
| 6L:23mils | 6L:23mils |
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Min.SMT/BGA Pitch | 12mils for SMT | 12mils for SMT |
| 24mils for BGA | 20mils for BGA |
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Min.Drill Size&Aspect Ratio | 0.2mm Drill for 0.8mm Thickness(4.0:1) | 0.2mm Drill for 0.8mm
Thickness(4.0:1) |
| 0.25mm Drill for 1.6mm
Thickness(6.4:1) | 0.25mm Drill for 1.6mm
Thickness(6.4:1) |
| 0.30mm Drill for 2.4mm
Thickness(8.0:1) | 0.30mm Drill for 2.4mm
Thickness(8.0:1) |
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Surface Finishes | HASL | HASL |
| Selective Immersion Tin | Selective Immersion Tin |
| Immersion Silver | Immersion Silver |
| Immersion Gold | Immersion Gold |
| Hard Gold | Hard Gold |
| OSP | OSP |
| Gold finger | Gold finger |
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Controlled Impedance | +/- 10% | +/-7% |
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Contouring | Routing, V-Groove, | Routing, V-Groove, |
| Beveling Punch | Beveling Punch |
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Hole Diameter | +/- 2 mil | +/- 2 mil |
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Min.S/M Thickness | 0.4 mil | 0.6 mil |
Logistics Support
For small and middle size quantity, we can provide competitive price for DHL/UPS/TNT/FEDEX, as we work with the forwarder agent as strategy cooperation partner, the price will be far cheaper than we deliver by DHL/UPS/TNT/FEDEX directly, as the agent’s huge quantity expressed every day. The delivery time from China to Europe and North America is 3-4 days.
For large quantity, per the experience, import delivery charge will much better than export charge.so we suggest customer to get the price from local forwarder. We can send the PCB to the forwarder warehouse in Hong Kong or Shenzhen. We will provide the accurate weight/ packing information to customer after goods are ok.
We can send the approximate packing information to customer during the offer period to calculate the total cost of PCB.
Express Transport | small quantities and urgent cases | 3 to 5 days |
Transport by air | standard transport mode by air | 7 to 10 days |
Transport by sea | low cost transport for large volume | 5 weeks |
Transport by sea | for a better optimization cost | 3 weeks |