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Au 30U"High Frequency PCB Design 8 Layer Impedance Control PCB TG170
Key Specifications/Special Features:
Immpedance control PCB
Gold fingers (Au 30U")
8L Outer annular ring: 2mil
Min. via 0.2mm
Trace width 4mil/4mil
Outline: Rout
E-test: 100%
Inspection standard: IPC-A-600H/IPC-6012B, Class 2/3
Outgoing reports: Final inspection, E-test, solderability test, microsection and so on
Certificates: UL, SGS, RoHS, ISO14001:2004 and ISO/TS16949:2009
Quality Control
AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Micro BGAs
Chip scale packages
Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional
defects caused by component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Service Advantages
1. Fast Delivery
2. Strict quality control
3. Quality warranty
4. Convenient transportation
5. Customer-orientation
6. Non-disclosure agreement
Security class PCB process features:
Precision circuit, impedance control, hole density, small aperture
Application product:Video monitor, camera, NVR