Global Success Circuits Co.,Ltd
Global Success Circuits Co.,Ltd World’s Professional PCB Manufacturer
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0.25mm Black 94v0 FR4 Multilayer PCB Board With Gold Finger Impedance Control
FR4 Multilayer PCB with Gold finger and impedance control , Black 94v0 solder mask BGA PCB
Printed Circuit Board Manufacturing Capabilities Summary
In the table below is a comprehensive list of Global Success's key printed circuit board manufacturing capabilities. This list is designed to help you understand if Global Success's capabilities are a match for your design. It will also allow you to plan ahead and create your design within these capabilities so that you can be sure Global Success can produce your PCB.
| OVERALL BOARD FEATURES | |
| LAYER COUNT | UP TO 14 |
| THICKNESS MINIMUM | .025" |
| THICKNESS MAXIMUM | .200" |
| THICKNESS TOLERANCE | +/- 10% |
| BOW AND TWIST TOLERANCE | 0.5% |
| MAXIMUM PCB Panel SIZE(s) | Up to 10" X 16" (on a 12" X 18" panel; this panel size is commonly used) |
| MATERIALS AND DIELECTRICS | |
| MATERIALS | FR-4 FAMILY |
|
| POLYIMIDE |
|
| ROGERS 3000 SERIES |
|
| ROGERS 4000 SERIES |
|
|
|
| BONDING SHEETS - PRE-PREG | TO MATCH CORE MATERIAL |
|
| HYBRID CONSTRUCTIONS |
| INNER LAYER THICKNESS MINIMUM | .005" |
| DIELECTRIC MINIMUM | .003" |
| INNER COPPER THICKNESS - MIN (BASE) | .0007" (1/2 OZ) |
| INNER LAYER COPPER THICKNESS - MAX | .0028" (2 OZ) |
| OUTER COPPER THICKNESS - MIN (BASE) | .0007" (1/2 OZ) |
| OUTER COPPER THICKNESS - MAX (BASE) | .0055"(4 OZ) |
| HOLES | |
| SMALLEST MECHANICALLY DRILLED HOLE | .010" |
| SMALLEST LASER HOLE | .006" |
| PLATING - SPECIAL HOLES - MIN | .0008" |
| MAXIMUM PLATING IN HOLES | .001" - .002" |
| PLATED HOLE TOLERANCE - DIAMETER | .004" |
| PLATING ASPECT RATIO - MAXIMUM | 12:1 |
| HOLE PREP TYPE | PERMANGANATE |
|
| PLASMA |
| LINE AND SPACE | |
| INNER LAYER LINE WIDTH MINIMUM | .004" |
| INNER TRACE WIDTH TOLERANCE | +/- .001" |
| OUTER LAYER LINE WIDTH MINIMUM | .004" |
| OUTER LAYER SPACE MINIMUM | .004" |
| OUTER TRACE WIDTH TOLERANCE | +/- .001" |
| PADS | |
| PAD SIZE OVER HOLE DIAMETER | .015" |
| SOLDERMASK | |
| TYPE | LPI - MOST COLORS |
|
| THERMAL CURE |
| PAD CLEARANCE MINIMUM | .006" |
| MINIMUM LINE WIDTH - MASK | .005" |
| REGISTRATION TOLERANCE | .004" |
| FINAL FINISH | |
| HOT AIR LEVEL | .0005" -.0015" |
| HARD GOLD | 30-50 MICROINCHES |
| SOFT BONDABLE GOLD | 20-40 MICROINCHES |
| FULL BODY GOLD | 20-40 MICROINCHES |
| ELECTROLESS NICKEL | 100-200 MICROINCHES |
| IMMERSION GOLD | 3-5 MICROINCHES |
| TIN/NICKEL | 100-300 MICROINCHES |
| IMMERSION SILVER | 3-4 MICROINCHES |
| LEGEND | |
| TYPE | MOST COLORS |
| CHARACTER LINE WIDTH MINIMUM | .007" |
| FINAL FABRICATION | |
|
| V-GROOVE ARRAY |
|
| ROUTED PIECE |
|
| COUNTERSINK |
|
| COUNTERBORE |
|
| EDGE BEVEL |
|
| EDGE-MILL |
| MINIMUM INSIDE RADIUS | .015" |
| ELECTRICAL TEST | |
| TYPE | CLAM-SHELL |
|
| FLYING PROBE |
|
| TDR |
| TEST SPECIFICATION | IPC CLASS I, II, III |
| REPORTS AVAILABLE ON REQUEST | |
| TYPE | MICROSECTION |
|
| SOLDERABILITY |
|
| X-RAY FLUORESCENCE |
|
| IONIC CONTAMINATION |
| CONTROLLED IMPEDANCE | |
| TESTING | TDR |
| TYPE | SINGLE END |
|
| DIFFERENTIAL |
| METAL CORE | |
| TYPE | ALUMINUM |
| BLIND VIA PROCESSING | |
| TYPE | SEQUENTIAL LAM |
| SMALLEST HOLE | .006" |
| SILVER OR EPOXY FILL | AVAIL SEQ LAM |
| MICRO VIA PROCESSING | |
| SMALLEST HOLE | .010" |
| SILVER OR EPOXY FILL | .010" |
| MICRO VIA PROCESSING |
|
| SMALLEST HOLE | .006" |
| CAPTURE PAD OVER HOLE SIZE - MIN | .012" |
| PLATING ASPECT RATIO | .5:1 |
| DIELECTRIC - MICROVIA LAYER | .002" (+/- .0005) |
| MATERIALS - MICROVIA LAYER | RESIN COATED FOIL |
|
| NON-WOVEN ARAMID |
| PCB SPECIFICATIONS | |
| IPC CLASS | IPC-A-600 CLASS I, II, III |
| MILITARY | ROUTED PIECE |
| LEAD TIMES | |
|
| 24 HOUR - QUICK TURN |
|
| 24 HOUR - QUICK TURN |
|
| 72 HOUR - QUICK TURN |
|
| MEDIUM VOLUME |
|
| HIGH VOLUME |
How we can guarantee the quality of our products?
1,Design Rule Chekc (DRC)
The Design Rules Check (DRC) is a very important step in PCB quality control . we will use an automated tool to verify that the layout does not have any specific placement, routing or other addressable layout errors. All of your boards must include DRC.
2, Automated optical inspection (AOI)
AOI is for checking the inner layers of multi-layers PCB. It scans the surface of the PCB and compares with our data, eg,line width,line space, excess copper, missing copper.hole breakage.
All multi-layers have to pass AOI .
3 ,ISO9001
We are ISO 9001:2015 certificated, For the following activities Project management and logistics control for the production of printed circuit boards.
4, Manufacturing Rule Check (MRC)
Some free versions and latest versions softwares always have bugs which DRC can not pick up the mistakes.,we will do MRC here, MRC will check your designs, such as missing pads,missing polygon copper, Wrong width/space to do .
5, Electrical Testing (ET)
ET is testing the netlist generated from your design/gerber. It can defect Short /open ciruit. Prototypes:testing by fly probe. Production:Testing by A fixture. All boards have to pass ET.
6, UL
Our products comply with UL safety certification 94V-0.
Our MI and CAM engineers have over 5 years experience.the picture below is an example that many customers designed inner layer short or open circuit.
We have the eagle eye to pick this out and optimize the designs to perfect manufacturing process.
