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2 Layer Double Side PCB Board Gold Plating For Industry Control System
Double layers PCB is the most common but very important PCB in the electronic market,its technology is simple,but the use is very wide,it can be use in communication,equipment,and computer,.etc.
The common surface finish for 2 layers PCB is HAL and immersion gold.For HAL,the surface looks good,the pads are slivery,it’s easily for soldering,and price is cheaper.For immersion gold,the quality is much stable,and the price is expensive than HAL.
The normal material for 2 layers PCB is FR4,and there are also high TG material and aluminium can be chose according to different use.
Two layers PCB prototype and volume production are both welcomed from Global Success.Here you can get competitive price and high quality and fast delivery.
Below is a part of our PCB capacity
Item | Capability |
Quality Grade | Standard IPC 2 |
Number of Layers | 1 – 14layers |
Order Quantity | 1pc – 10000+pcs |
Build Time | 2days – 5weeks (Expedited Service) |
Material | FR-4 Standard Tg 140°C, FR4-High Tg 170°C, FR4-Sigh-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg |
Board Size | Min 0.236*0.236″ | Max 23.6*23.6″
Min 6*6mm | Max 600*700mm |
Board size tolerance | ±0.0039″-±0.0118″
±0.1mm – ±0.3mm |
Board Thickness | 0.0157″-0.126″
0.4mm – 3.2mm |
Board Thickness Tolerance | ±0.0039″-±10%
±0.1mm – ±10% |
Copper Weight | 0.5oz – 6.0oz
18um-210um |
Inner Layer Copper Weight | 0.5oz – 2.0oz
18um-70um |
Copper Thickness Tolerance | +0μm +20μm |
Min Tracing/Spacing | 3mil/3mil
0.0762mm/0.0762mm |
Solder Mask Sides | As per the file |
Solder Mask Color | Green, White, Blue, Black, Red, Yellow |
Silkscreen Sides | As per the file |
Silkscreen Color | White, Blue, Black, Red, Yellow |
Surface Finish | HASL – Hot Air Solder Leveling Lead Free HASL – RoHS ENIG – Electroless Nickle/Immersion Gold – RoHS ENEPIG – Electroless Nickel Electroless Palladium Immersion Gold – RoHS Immersion Silver – RoHS Immersion Tin – RoHS OSP -Organic Solderability Preservatives – RoHS |
Min Annular Ring | 3mil(0.0762mm) |
Min Drilling Hole Diameter | 6mil(0.15mm), 4mil(0.1mm)-laser drill |
Min Width of Cutout (NPTH) | 0.0315″(0.8mm) |
NPTH Hole Size Tolerance | ±0.002″ (±0.05mm) |
Min Width of Slot Hole (PTH) | 0.0236″(0.6mm) |
PTH Hole Size Tolerance | ±.003″ (±0.08mm) – ±.006″ (±0.15mm) |
Surface/Hole Plating Thickness | 20μm – 30μm |
SM Tolerance (LPI) | 0.003″ (0.075mm) |
Aspect Ratio | 1:10 (hole size: board thickness) |
Test | 10V – 250V, flying probe or testing fixture |
Impedance tolerance | ±5% – ±10% |
SMD Pitch | 0.008″/0.2mm/8mil |
BGA Pitch | 0.008″/0.2mm/8mil |
Chamfer of Gold Fingers | 20, 30, 45, 60 |
Other Techniques | Gold fingers Blind and Buried Holes peelable solder mask Edge plating Carbon Mask Kapton tape Countersink/counterbore hole Half-cut/Castellated hole Press fit hole Via tented/covered with resin Via plugged/filled with resin Via in pad Electrical Test |
PCB Specification
Quotation support