Global Success Circuits Co.,Ltd

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2 Layer Double Side PCB Board Gold Plating For Industry Control System

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Global Success Circuits Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrsRose Guo
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2 Layer Double Side PCB Board Gold Plating For Industry Control System

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Brand Name :Global Success Circuits Co.,Ltd
Model Number :GSC-W35E4F
Certification :UL ISO 14001 TS16949 ISO 9001
Place of Origin :China (mainland)
MOQ :1 Piece
Payment Terms :T/T, L/C, D/A, D/P, Western Union
Delivery Time :5 - 14 days
Packaging Details :Vacuum Packing and High Quality Carton Box
Layer :2
Material :FR4
PCB thickness :1.6mm ±10%
Minimum hole size :0.2mm
Soldermask :green
Surface :immersion gold
Outgoing reports :final inspection, e-test, solderability test, micro section and more
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2 Layer Double Side PCB Board Gold Plating For Industry Control System

Double layers PCB is the most common but very important PCB in the electronic market,its technology is simple,but the use is very wide,it can be use in communication,equipment,and computer,.etc.

The common surface finish for 2 layers PCB is HAL and immersion gold.For HAL,the surface looks good,the pads are slivery,it’s easily for soldering,and price is cheaper.For immersion gold,the quality is much stable,and the price is expensive than HAL.

The normal material for 2 layers PCB is FR4,and there are also high TG material and aluminium can be chose according to different use.

Two layers PCB prototype and volume production are both welcomed from Global Success.Here you can get competitive price and high quality and fast delivery.

Below is a part of our PCB capacity

Item Capability
Quality Grade Standard IPC 2
Number of Layers 1 – 14layers
Order Quantity 1pc – 10000+pcs
Build Time 2days – 5weeks (Expedited Service)
Material FR-4 Standard Tg 140°C, FR4-High Tg 170°C, FR4-Sigh-Tg 180°C, FR4-Halogen-free, FR4-Halogen-free & High-Tg
Board Size Min 0.236*0.236″ | Max 23.6*23.6″

Min 6*6mm | Max 600*700mm

Board size tolerance ±0.0039″-±0.0118″

±0.1mm – ±0.3mm

Board Thickness 0.0157″-0.126″

0.4mm – 3.2mm

Board Thickness Tolerance ±0.0039″-±10%

±0.1mm – ±10%

Copper Weight 0.5oz – 6.0oz

18um-210um

Inner Layer Copper Weight 0.5oz – 2.0oz

18um-70um

Copper Thickness Tolerance +0μm +20μm
Min Tracing/Spacing 3mil/3mil

0.0762mm/0.0762mm

Solder Mask Sides As per the file
Solder Mask Color Green, White, Blue, Black, Red, Yellow
Silkscreen Sides As per the file
Silkscreen Color White, Blue, Black, Red, Yellow
Surface Finish HASL – Hot Air Solder Leveling
Lead Free HASL – RoHS
ENIG – Electroless Nickle/Immersion Gold – RoHS
ENEPIG – Electroless Nickel Electroless Palladium Immersion Gold – RoHS
Immersion Silver – RoHS
Immersion Tin – RoHS
OSP -Organic Solderability Preservatives – RoHS
Min Annular Ring 3mil(0.0762mm)
Min Drilling Hole Diameter 6mil(0.15mm), 4mil(0.1mm)-laser drill
Min Width of Cutout (NPTH) 0.0315″(0.8mm)
NPTH Hole Size Tolerance ±0.002″ (±0.05mm)
Min Width of Slot Hole (PTH) 0.0236″(0.6mm)
PTH Hole Size Tolerance ±.003″ (±0.08mm) – ±.006″ (±0.15mm)
Surface/Hole Plating Thickness 20μm – 30μm
SM Tolerance (LPI) 0.003″ (0.075mm)
Aspect Ratio 1:10 (hole size: board thickness)
Test 10V – 250V, flying probe or testing fixture
Impedance tolerance ±5% – ±10%
SMD Pitch 0.008″/0.2mm/8mil
BGA Pitch 0.008″/0.2mm/8mil
Chamfer of Gold Fingers 20, 30, 45, 60
Other Techniques Gold fingers
Blind and Buried Holes
peelable solder mask
Edge plating
Carbon Mask
Kapton tape
Countersink/counterbore hole
Half-cut/Castellated hole
Press fit hole
Via tented/covered with resin
Via plugged/filled with resin
Via in pad
Electrical Test

PCB Specification

IPC-A-600 Acceptability of Printed Wiring Boards (default class 2)
IPC-6011 Generic Performance Specification for Printed Wiring Boards
IPC-6012 Qualification and Performance specs. (default class 2)
IPC-TM-650 Test methods manual.
IPC-4101 Specification for base materials rigid / multi-layer

Quotation support

Starting Requirements and Specifications
(1) Gerber data for all artwork layers
(2) Aperture list (If artwork data are RS-274-X format,Please ignore this.)
(3) Drill file (including hole sizes)
(4) Outline panel drawing
(5) Special notes or "Read Me" files pertaining to:
1 Board material and thickness
2 Finished copper thickness
3 Color / type of solder-mask
4 Color of silkscreen
5 Surface finishes (HAL Pb free, immersion gold etc.)
6 Lay up for multilayer printed board
7 Controlled impedance
8 Other special requirements or instructions
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