Base materials: high-temperature FR4/FR5, free halogen FR4, aluminum based, polyimide, Rogers, Argon and Teflon/PTFE
Layers: 1 to 30 layers standard PCB, blind and buried via board
Minimum track space: 4/4, 3mils partial allowed
Maximum size: 1000 x 1200mm
Minimum size: 3 x 3mm
Surface copper thickness:
Maximum: 6/6 ounce
Minimum: 0.5/0.5 ounce
Hard gold thickness: maximum 50u
Maximum board thickness: 6.0mm
Finish: SMOBC/HASL, lead-free SMOBC/HASL, organic OSP, hard and soft gold, plating tin, immersion silver, immersion tin and electro less nickel/immersion gold

Production capability for 4 layers PCB with Immersion Gold Surface Finish and Green solder mask Quick turn:

Layer	1 to 28 layers
Material types	FR-4,CEM-1,CEM-3,High TG,FR4 halogen free, rogers
Board thickness	0.21 to 7.0mm
Copper thickness	0.5 to 7.0oz
Copper thickness in hole	>25.0um(>1mil)
Sizes	- Max board size: 23 × 25 (580x900mm) - Min drilled hole size: 3mil (0.075mm) - Min line width: 3mil (0.075mm) - Min line spacing: 3mil (0.075mm)
Surface finishing	HASL/HASL lead-free, HAL, chemical tin, chemical gold, immersion silver/gold, OSP, gold plating
Tolerance	- Shape tolerance: ±0.13 - Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Certificate	UL, ISO 9001, ISO 14001
Special requirements	buried and blind vias + controlled impedance + BGA Profiling punching, routing, V-CUT, beveling

Certificates for 4 layers PCB with Immersion Gold Surface Finish and Green solder mask Quick turn:

ISO 9001-2008, ISO TS 16949, OHSAS18001, CQC, UL, Reach, Rohs

Lead time for 4 layers PCB with Immersion Gold Surface Finish and Green solder mask Quick turn:

7-14 days according to real order quantity.

Mass production plants information for 4 layers PCB with Immersion Gold Surface Finish and Green solder mask Quick turn:

Product Tags:

4 Layer Quick Turn PCB Assembly Prototype Circuit Board Green Solder Mask

FR4 PCB Board