Global Success Circuits Co.,Ltd

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Fast PCB Prototype Assembly Services , Aluminum Base Blank Circuit Board

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Global Success Circuits Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrsRose Guo
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Fast PCB Prototype Assembly Services , Aluminum Base Blank Circuit Board

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Brand Name :Global Success Circuits Co.,Ltd
Model Number :GSC-PA126AD
Certification :UL (E324220), ISO 14001, TS16949, ISO 9001, SGS
Place of Origin :CHINA
MOQ :1
Payment Terms :T/T
Supply Ability :50000SQM/MONTH
Packaging Details :vacuum
Layer count :1
Laminate :Aluminum
Finished copper :1oz
Soldermask color :White
Silkscreen color :Black
Surface finish :HASL Lead free
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Fast PCB Prototype Assembly Services , Aluminum Base Blank Circuit Board

  • Layers: 1-18 layers
  • Materials: CEM1, CEM3, Teflon, Rogers,FR-4, High Tg FR-4, Aluminum Base, Halogen Free
  • Max. Board Size: 510*1200mm
  • Material: RoHS Directive-compliant
  • PCB thickness: 1.6 ±0.1mm
  • Out Layer Copper Thickness: 1-6oz
  • Inner Layer Copper Thickness: 1/2oz-5oz
  • Max. board Thickness: 6.0mm
  • Minimum hole size: 0.20mm
  • Minimum line width/space: 3/3mil
  • Min. S/M Pitch: 0.1mm(4mil)
  • Plate thickness and aperture ratio : 12:1
  • Minimum hole copper: 20µm
  • Hole dia. Tolerance(PTH):±0.075mm(3mil)
  • Hole dia. Tolerance(NPTH):±0.05mm (2mil)
  • Hole position deviation:±0.05mm (2mil)
  • Outline tolerance:±0.05mm (2mil)
  • Surface finished:HASL Leadfree,Immersion ENIG,Chem Tin,Flash Gold,OSP,Gold finger,Peelable,Immersion Silver
  • Solder mask: green
  • Legend: white
  • Outline: rout and score/V-cut
  • E-test: 100%
  • Inspection standard: IPC-A-600H/IPC-6012B, Class 2
  • Outgoing reports: final inspection, E-test, solderability test, micro section and more
  • Certificates: UL (E324220), ISO 14001, TS16949, ISO 9001, SGS

Layer

1-16layer

Max Board size

1100*599mm 43.3" * 24"

Min Board Thickness

4 layer 0.40mm 16mil

6 layer 1.00mm 40mil

8 layer 1.20mm 48mil

10 layer 1.60mm 60mil

Min space

0.075mm / 3mil

Min line width

0.075mm / 3mil

Min hole size

0.1mm 4mil

Plated wall thickness

0.025mm 1mil

Plated hole dia tolerance

±0.10mm 4mil

NO Plated hole dia tolerance

±0.05mm 2mil

Hole position deviation

±0.05mm 2mil

Outline tolerance

±0.15mm 6mil

Min S/M bridge

0.1mm 4mil

Twist and bent

≤1.5%

Insulation resistance

1012Ω (Normal)

Through hole resistance

<300Ω(Normal)

Electric strength

>1.3KV/mm

Current strength

10A

Peel strength

1.5N/mm

Solder mask abrasion

>4H

Thermal stress

288℃20 Seconds

Flammability

94V-0

Test voltage

50-300V

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