Global Success Circuits Co.,Ltd
Global Success Circuits Co.,Ltd World’s Professional PCB Manufacturer
Add to Cart
Immersion Gold Tg150 PCB Halegon Free FR4 PCB Green Or Red Solder Mask
specification for High TG halegon-free FR4 PCB with immersion gold in green or red solder mask
1. Base material: FR4
2. Copper Thickness: 1Oz
3. surface finishing: LF-HASL
4. board thickness: 1.6mm
PCB production ability for High TG halegon-free FR4 PCB with immersion gold in green or red solder mask
| Category | Description | Capability |
| Laminate Material | FR4, High TG FR4(tg150,tg170,tg180) Halogen-free FR4, CEM1, CEM3,Polyimide, Rogers ,Aluminum | We will order other special material accoprding to your request |
| Board Layers | Maximum layers | 1-18layers |
| Size | Maximum finished dimensions | 500*1200mm |
| Board Thickness | Minimum and Maximum | 0.2-3.2mm |
| Copper | Outer copper weight | 0.5oz (17um) - 4oz (140um) |
| Inner copper weight | 0.5oz (17um) - 4 oz (105um) | |
| Drilling | Minimum drilling size | 0.15mm |
| Drill Deviation (True position size) | 2mil (0.050mm) | |
| PTH hole tolerance | 3mil (0.075mm) | |
| N-PTH hole tolerance | 2mil (0.050mm) | |
| Minimum hole wall thickness | 20um | |
| Angle of Countersink | 80°, 90°, 100°, 120° | |
| Circuit line | Minimum width | 0.1mm/ 4mil |
| Minimum space | 0.1mm/ 4mil | |
| Inner Layers | Minimum space from drilling to inner pattern | 6mil (0.15mm) |
| Minimum space from annular ring to inner pattern | 6mil (0.15mm) | |
| Layer-to-layer registration | 3mil (0.08mm) | |
| Board Profilling | Hole to board edge tolerance | ±4mil (0.1mm) |
| Pattern to board edge tolerance | ±4mil (0.1mm) | |
| CNC Tolerance | ±4mil (0.1mm) | |
| Minmum thickness after V-Cut | 12mil (0.3mm) | |
| V-Cut tolerance | ±5mil (0.12mm) | |
| V-Cut Angle | 20,30,45,60 | |
| Solder mask | Color | green, light green, matte green, white black,matte black,yellow,red, blue |
| Thickness | ≥17um | |
| Silkscreen | Color | White, black, yellow, red, blue, green, gray |
| Minimum line height | ≥0.0625mm | |
| Minimum line width | ≥0.125mm | |
| Surface Finish | HASL, HASL pb free, immersion gold, immersion silver, O.S.P | |
| Certification | IPC-A-600 Class II/III, UL E324220, ISO 9001,ISO/TS16949, ROHS | |
Application for High TG halegon-free FR4 PCB with immersion gold in green or red solder mask:
health tech, medical, energy, lighting, defense, aerospace, industrial controls, consumer and transportation.
Lead time for High TG halegon-free FR4 PCB with immersion gold in green or red solder mask
| Production types | Layer No. | Lead Time |
| Samples | 1, 2 layers | 3-4 days |
| 4, 6 layers | 7-8 days | |
| ≧ 8 Layer | 10-12 days | |
| Mass Production | 1, 2 layers | 7-8 days |
| 4, 6 layers | 10-12 days | |
| ≧ 8 Layer | 15 days | |
| 1, 2 layers | 2 days | |
| 4, 6 layers | 5 days | |
| ≧ 8 Layer | 7 days |
Related product of High TG halegon-free FR4 PCB with immersion gold in green or red solder mask
