Global Success Circuits Co.,Ltd
Global Success Circuits Co.,Ltd World’s Professional PCB Manufacturer
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Automotive Product TG 170 PCB FR4 Multi Layer Circuit Board With Blind / Bury Holes
1. Base material: FR4
2. Copper Thickness: 1Oz
3. surface finishing: LF-HASL
4. board thickness: 1.6mm
PCB production ability for High TG halegon-free FR4 multi-layer PCB with blind and bury holes for automotive product
| Category | Description | Capability |
| Laminate Material | FR4, High TG FR4(tg150,tg170,tg180) Halogen-free FR4, CEM1, CEM3,Polyimide, Rogers ,Aluminum |
We will order other special material accoprding to your request |
| Board Layers | Maximum layers | 1-18layers |
| Size | Maximum finished dimensions | 500*1200mm |
| Board Thickness | Minimum and Maximum | 0.2-3.2mm |
| Copper | Outer copper weight | 0.5oz (17um) - 4oz (140um) |
| Inner copper weight | 0.5oz (17um) - 4 oz (105um) | |
| Drilling | Minimum drilling size | 0.15mm |
| Drill Deviation (True position size) | 2mil (0.050mm) | |
| PTH hole tolerance | 3mil (0.075mm) | |
| N-PTH hole tolerance | 2mil (0.050mm) | |
| Minimum hole wall thickness | 20um | |
| Angle of Countersink | 80°, 90°, 100°, 120° | |
| Circuit line | Minimum width | 0.1mm/ 4mil |
| Minimum space | 0.1mm/ 4mil | |
| Inner Layers | Minimum space from drilling to inner pattern | 6mil (0.15mm) |
| Minimum space from annular ring to inner pattern | 6mil (0.15mm) | |
| Layer-to-layer registration | 3mil (0.08mm) | |
| Board Profilling | Hole to board edge tolerance | ±4mil (0.1mm) |
| Pattern to board edge tolerance | ±4mil (0.1mm) | |
| CNC Tolerance | ±4mil (0.1mm) | |
| Minmum thickness after V-Cut | 12mil (0.3mm) | |
| V-Cut tolerance | ±5mil (0.12mm) | |
| V-Cut Angle | 20,30,45,60 | |
| Solder mask | Color | green, light green, matte green, white black,matte black,yellow,red, blue |
| Thickness | ≥17um | |
| Silkscreen | Color | White, black, yellow, red, blue, green, gray |
| Minimum line height | ≥0.0625mm | |
| Minimum line width | ≥0.125mm | |
| Surface Finish | HASL, HASL pb free, immersion gold, immersion silver, O.S.P | |
| Certification | IPC-A-600 Class II/III, UL E324220, ISO 9001,ISO/TS16949, ROH | |
Lead time for High TG halegon-free FR4 multi-layer PCB with blind and bury holes for automotive product
| Production types | Layer No. | Lead Time |
| Samples | 1, 2 layers | 3-4 days |
| 4, 6 layers | 7-8 days | |
| ≧ 8 Layer | 10-12 days | |
| Mass Production | 1, 2 layers | 7-8 days |
| 4, 6 layers | 10-12 days | |
| ≧ 8 Layer | 15 days | |
| 1, 2 layers | 2 days | |
| 4, 6 layers | 5 days | |
| ≧ 8 Layer | 7 days |
Factory over-view for High TG halegon-free FR4 multi-layer PCB with blind and bury holes for automotive product