Global Success Circuits Co.,Ltd
Global Success Circuits Co.,Ltd World’s Professional PCB Manufacturer
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1.5 OZ ENIG FR4 PCB Board Electronic Circuit Board PCBA Board Green Solder Mask
Please call GSC if you need:
Fast turn-around prototypes.
Low-Medium-High volume production requirements.
To meet your prodution schedules.
On time delivery with a quality product.
A competitive price
Brief introduction of GS:
1. GS are ISO/TS and UL certified.
2. We have 3 factories and more than 1000 employees in China.
3. With very compitive price and high quality, 50% pcb are exported to Europe and America.
ShenZhen OEM ONE-STOP Electronic Assembly Manufacturer.
We strive to provide the best contract manufacturing services.
Shenzhen OEM UL & RoHS Compliant PCB FAB & Assembly.
PCB Circuit Board Assembly Manufacturer and PCB samples as far as one day.
What can we do for you?
EMS-electronic manufacturing service
PCB supply and layout
PCB assembly on SMT, BGA and DIP
Cost effective components sourcing
Fast turn prototype and mass production
Box build assembly
Engineering supported
Tests (X-ray, 3D paste thickness, ICT, AOI and functional tests)
| Materials | Standard | Advanced |
| FR4 (130‐180 Tg by DSC) | Y | Y |
| Halogen Free | Y | Y |
| BT Epoxy | Y | Y |
| Getek | Y | Y |
| Isola 370HR 406 408 IS410 IS 420 IS620 | Y | Y |
| Nelco 4000 | Y | Y |
| Rogers 4000 | Y | Y |
| PTFE | Y | Y |
| Dupont Pyralux | N | Y |
| Aluminum Core | Y | Y |
| Surface Finishes | ||
| ENIG | Y | Y |
| Flash Gold | Y | Y |
| Electrolytic Nickel/Hard Gold | Y | Y |
| HASL | Y | Y |
| Lead Free HASL | Y | Y |
| Immersion Ag | Y | Y |
| Standard Features | Standard | Advanced |
| Maximum layer count | 20 | 36 |
| Maximum Panel Size | 21″x24″ | 24″x30″ |
| Outer Layer Trace/Spacing (1/3 oz) | 0.0035″/0.0035″[90μm/90μm] | 0.0025″/0.003″[64μm/76μm] |
| Inner Layer Trace/Spacing (H oz) | 0.003″/0.003″ [76μm/76μm] | 0.002″/0.0025″ [50μm/64μm] |
| Maximum PCB thickness | 0.125″[3.2mm] | 0.177″[4.5mm] |
| Minimum PCB thickness | 0.008″[0.20mm] | 0.004″[0.10mm] |
| Minimum mechancial drill size | 0.008″[0.20mm] | 0.004″[0.10mm] |
| Maximum PCB aspect ration | 10:01 | 12:01 |
| Maximum copper weight | 5 oz [178μm] | 6 oz [214μm] |
| Minimum copper weight | 1/3 oz [12μm] | 1/4 oz [9μm] |
| Minimum core thickness | 0.002″[50μm] | 0.0015″[38μm] |
| Minimum dielectric thickness | 0.0025″[64μm] | 0.0015″[38μm] |
| Minimum Pad Size over Drill | 0.018″[0.46mm] | 0.016″[0.4mm] |
| Solder Mask Registration | +/‐ 0.002″[50μm] | +/‐ 0.0015″[38μm] |
| Mimimum Solder Mask Dam | 0.003″[76μm] | 0.0025″[64μm] |
| Copper feature to PCB edge | 0.015″[0.38mm] | 0.010″[0.25mm] |
| Tolerance on overall dimensions | +/‐ 0.004″[100μm] | +/‐ 0.002″[50μm] |
| HDI Features | ||
| Immersion Tin | Y | Y |
