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4 Layer High TG Heavy Copper PCB Board 3 Oz Copper Thickness Immersion Gold

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Global Success Circuits Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrsRose Guo
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4 Layer High TG Heavy Copper PCB Board 3 Oz Copper Thickness Immersion Gold

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Brand Name :Global Success Circuits Co.,Ltd
Model Number :GSC
Certification :UL , ISO . TS16949 , ROHS
Place of Origin :China
MOQ :1pcs
Payment Terms :D/A, D/P, T/T, Western Union
material :FR4
layers :4
copper :3oz
Min. Line Width :0.1mm
Min. Hole Size: 0.3mm :0.3mm
surface finish :immersion gold
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4 Layer High TG Heavy Copper PCB Board 3 Oz Copper Thickness Immersion Gold

applications:

  • Weapons Control Systems

  • Power Supplies for Radar Systems

  • Primary and Secondary Windings of High Power Planar Transformers

  • Power Distribution Panels

  • Battery Charger and Monitoring Systems

Power electronics products using heavy copper circuitry have been in use for many years in the military and aerospace industry and are gaining momentum as a technology of choice in industrial applications. It's believed that market requirements will extend the application of this type of product in the near future.

Category

Description

Capability

Laminate Material

FR4, High TG FR4(tg150,tg170,tg180)
Halogen-free FR4, CEM1, CEM3,Polyimide,
Rogers ,Aluminum

We will order other special material accoprding to your request

Board Layers

Maximum layers

1-18layers

Size

Maximum finished dimensions

500*1200mm

Board Thickness

Minimum and Maximum

0.2-3.2mm

Copper

Outer copper weight

0.5oz (17um) - 4oz (140um)

Inner copper weight

0.5oz (17um) - 4 oz (105um)

Drilling

Minimum drilling size

0.15mm

Drill Deviation (True position size)

2mil (0.050mm)

PTH hole tolerance

3mil (0.075mm)

N-PTH hole tolerance

2mil (0.050mm)

Minimum hole wall thickness

20um

Angle of Countersink

80°, 90°, 100°, 120°

Circuit line

Minimum width

0.1mm/ 4mil

Minimum space

0.1mm/ 4mil

Inner Layers

Minimum space from drilling to inner pattern

6mil (0.15mm)

Minimum space from annular ring to inner pattern

6mil (0.15mm)

Layer-to-layer registration

3mil (0.08mm)

Board Profilling

Hole to board edge tolerance

±4mil (0.1mm)

Pattern to board edge tolerance

±4mil (0.1mm)

CNC Tolerance

±4mil (0.1mm)

Minmum thickness after V-Cut

12mil (0.3mm)

V-Cut tolerance

±5mil (0.12mm)

V-Cut Angle

20,30,45,60

Solder mask

Color

green, light green, matte green, white black,matte black,yellow,red, blue

Thickness

≥17um

Silkscreen

Color

White, black, yellow,
red, blue, green, gray

Minimum line height

≥0.0625mm

Minimum line width

≥0.125mm

Surface Finish

HASL, HASL pb free, immersion gold, immersion silver, O.S.P

Certification

IPC-A-600 Class II/III, UL E324220, ISO 9001,ISO/TS16949, ROHS

The construction of a heavy copper circuit endows a board with benefits such as:

  • Increased endurance to thermal strains.

  • Increased current carrying capacity.

  • Increased mechanical strength at connector sites and in PTH holes.

  • Use of exotic materials to their full potential (i.e., high temperature) without circuit failure.

  • Reduced product size by incorporating multiple copper weights on the same layer of circuitry (see Figure 1).

  • Heavy copper plated vias carry higher current through the board and help to transfer heat to an external heatsink.

  • On-board heatsinks directly plated onto the board surface using up to 120-oz copper planes.

  • On-board high-power-density planar transformers

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