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ENIG 6 Layer Multilayer PCB Board Fabrication FR4 2.0mm Immersion Gold
Layer: 6L
Material: FR4 KB Laminate, 94V0 RoHS compliance
PCB Thickness:2.0mm+/-10%
Final Copper: 2/2oz
Soldermask: Green
Legend: White
Surface:Immersion Gold
Min line space/ width:5mil
Outline: Rout and Score/V-Cut
E-Test: 100%
Inspection Standard: IPC-A-600H/IPC-6012B, Class 2/3
Outgoing Reports: Final Inspection ,E-Test ,Solderability Test ,
Microsection and so on.
Certificates: ULE324220, SGS, RoHS, ISO14001:2004, ISO/TS16949:2009
Multi-layer Printed Circuit Boards
The multilayer PCB is the development of the double sided PCB. With increasing complexity and density of components many designers were struggling to find the route and size required for modern instruments. Adding just a power and ground plane to the inside of the board allowed the components to be powered with just two plated holes to the inner layers rather than a track back to a power/ground point. Once the technology to multilayer PCBs was established, it was further developed to have additional signal layers inside. This allowed the designers to produce highly complex and compact circuits and further development of blind and buried via hole technology has pushed these limits even further. The highly complex PCBs now being offered allow high density packaging to the designer’s requirement and in line with the most complex components.
Technology
Category | Description | Capability |
Laminate Material | FR4, High TG FR4(tg150,tg170,tg180) Halogen-free FR4, CEM1, CEM3,Polyimide, Rogers ,Aluminum | We will order other special material accoprding to your request |
Board Layers | Maximum layers | 1-18layers |
Size | Maximum finished dimensions | 500*1200mm |
Board Thickness | Minimum and Maximum | 0.2-3.2mm |
Copper | Outer copper weight | 0.5oz (17um) - 4oz (140um) |
Inner copper weight | 0.5oz (17um) - 4 oz (105um) | |
Drilling | Minimum drilling size | 0.15mm |
Drill Deviation (True position size) | 2mil (0.050mm) | |
PTH hole tolerance | 3mil (0.075mm) | |
N-PTH hole tolerance | 2mil (0.050mm) | |
Minimum hole wall thickness | 20um | |
Angle of Countersink | 80°, 90°, 100°, 120° | |
Circuit line | Minimum width | 0.1mm/ 4mil |
Minimum space | 0.1mm/ 4mil | |
Inner Layers | Minimum space from drilling to inner pattern | 6mil (0.15mm) |
Minimum space from annular ring to inner pattern | 6mil (0.15mm) | |
Layer-to-layer registration | 3mil (0.08mm) | |
Board Profilling | Hole to board edge tolerance | ±4mil (0.1mm) |
Pattern to board edge tolerance | ±4mil (0.1mm) | |
CNC Tolerance | ±4mil (0.1mm) | |
Minmum thickness after V-Cut | 12mil (0.3mm) | |
V-Cut tolerance | ±5mil (0.12mm) | |
V-Cut Angle | 20,30,45,60 | |
Solder mask | Color | green, light green, matte green, white black,matte black,yellow,red, blue |
Thickness | ≥17um | |
Silkscreen | Color | White, black, yellow, red, blue, green, gray |
Minimum line height | ≥0.0625mm | |
Minimum line width | ≥0.125mm | |
Surface Finish | HASL, HASL pb free, immersion gold, immersion silver, O.S.P | |
Certification | IPC-A-600 Class II/III, UL E324220, ISO 9001,ISO/TS16949, ROHS | |
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