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ENIG 6 Layer Multilayer PCB Board Fabrication FR4 2.0mm Immersion Gold

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Global Success Circuits Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrsRose Guo
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ENIG 6 Layer Multilayer PCB Board Fabrication FR4 2.0mm Immersion Gold

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Brand Name :Global Success Circuits
Model Number :VPCB71
Certification :UL,ISO 9001-2008, ISO TS 16949
Place of Origin :China (mainland)
MOQ :1 Piece
Payment Terms :L/C, T/T, Western Union
Delivery Time :3 - 10 days
Packaging Details :vacum packing with rigid box
Material :FR4
Layer count :6 layer
Board thickness :2.0mm
copper layer :2 oz finish
Hole Wall Copper :≥20μm
Surface Finish :ENIG(Electroless Nickel Immersion Gold)
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ENIG 6 Layer Multilayer PCB Board Fabrication FR4 2.0mm Immersion Gold

Layer: 6L
Material: FR4 KB Laminate, 94V0 RoHS compliance
PCB Thickness:2.0mm+/-10%
Final Copper: 2/2oz
Soldermask: Green
Legend: White
Surface:Immersion Gold
Min line space/ width:5mil
Outline: Rout and Score/V-Cut
E-Test: 100%
Inspection Standard: IPC-A-600H/IPC-6012B, Class 2/3
Outgoing Reports: Final Inspection ,E-Test ,Solderability Test ,
Microsection and so on.
Certificates: ULE324220, SGS, RoHS, ISO14001:2004, ISO/TS16949:2009

Multi-layer Printed Circuit Boards

The multilayer PCB is the development of the double sided PCB. With increasing complexity and density of components many designers were struggling to find the route and size required for modern instruments. Adding just a power and ground plane to the inside of the board allowed the components to be powered with just two plated holes to the inner layers rather than a track back to a power/ground point. Once the technology to multilayer PCBs was established, it was further developed to have additional signal layers inside. This allowed the designers to produce highly complex and compact circuits and further development of blind and buried via hole technology has pushed these limits even further. The highly complex PCBs now being offered allow high density packaging to the designer’s requirement and in line with the most complex components.


Technology

Category Description Capability
Laminate Material FR4, High TG FR4(tg150,tg170,tg180)
Halogen-free FR4, CEM1, CEM3,Polyimide,
Rogers ,Aluminum
We will order other special material accoprding to your request
Board Layers Maximum layers 1-18layers
Size Maximum finished dimensions 500*1200mm
Board Thickness Minimum and Maximum 0.2-3.2mm
Copper Outer copper weight 0.5oz (17um) - 4oz (140um)
Inner copper weight 0.5oz (17um) - 4 oz (105um)
Drilling Minimum drilling size 0.15mm
Drill Deviation (True position size) 2mil (0.050mm)
PTH hole tolerance 3mil (0.075mm)
N-PTH hole tolerance 2mil (0.050mm)
Minimum hole wall thickness 20um
Angle of Countersink 80°, 90°, 100°, 120°
Circuit line Minimum width 0.1mm/ 4mil
Minimum space 0.1mm/ 4mil
Inner Layers Minimum space from drilling to inner pattern 6mil (0.15mm)
Minimum space from annular ring to inner pattern 6mil (0.15mm)
Layer-to-layer registration 3mil (0.08mm)
Board Profilling Hole to board edge tolerance ±4mil (0.1mm)
Pattern to board edge tolerance ±4mil (0.1mm)
CNC Tolerance ±4mil (0.1mm)
Minmum thickness after V-Cut 12mil (0.3mm)
V-Cut tolerance ±5mil (0.12mm)
V-Cut Angle 20,30,45,60
Solder mask Color green, light green, matte green, white black,matte black,yellow,red, blue
Thickness ≥17um
Silkscreen Color White, black, yellow,
red, blue, green, gray
Minimum line height ≥0.0625mm
Minimum line width ≥0.125mm
Surface Finish HASL, HASL pb free, immersion gold, immersion silver, O.S.P
Certification IPC-A-600 Class II/III, UL E324220, ISO 9001,ISO/TS16949, ROHS



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ENIG 6 Layer Multilayer PCB Board Fabrication FR4 2.0mm Immersion GoldENIG 6 Layer Multilayer PCB Board Fabrication FR4 2.0mm Immersion GoldENIG 6 Layer Multilayer PCB Board Fabrication FR4 2.0mm Immersion Gold

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