Global Success Circuits Co.,Ltd
Global Success Circuits Co.,Ltd World’s Professional PCB Manufacturer
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FR4 1.6mm 1OZ Multilayer Pcb Manufacturing Process For Telecommunications
Multilayer PCB
Multilayer PCB is a circuit board that has more than two layers.
Unlike a Double-Sided PCB which only has two conductive layers of material, all multilayer PCBs must have at least three layers of conductive material which are buried in the center of the material.
Benefits of Multilayer PCBs (compared to single or double-sided PCBs)
Applications of Multilayer PCBs
While the weight and space benefits of multilayer PCBs are especially valuable for Aerospace PCBs, multilayer PCBs are also beneficial to applications where "cross-talk" levels are critical. These are a few other the applications using multilayer printed circuit boards:
PCB Fabrication Capability | ||
| No | Item | PCB Process Capability |
| 1 | base material | Normal TG FR4, High TG FR4, PTFE, Rogers, Low Dk/Df etc. |
| 2 | Solder mask color | green, red, blue, white, yellow, purple,black |
| 3 | Legend color | white, yellow, black, red |
| 4 | Surface treatment type | ENIG, Immersion tin, HAF, HAF LF, OSP, flash gold, gold finger, sterling silver |
| 5 | Max. layer-up(L) | 14 |
| 6 | Max. unit size (mm) | 620*813 (24″*32″) |
| 7 | Max. working panel size (mm) | 620*900 (24″x35.4″) |
| 8 | Max. board thickness (mm) | 3.5 |
| 9 | Min. board thickness(mm) | 0.3 |
| 10 | Board thickness tolerance (mm) | T<1.0 mm: +/-0.10mm ; T≥1.00mm: +/-10% |
| 11 | Registration tolerance (mm) | +/-0.10 |
| 12 | Min. mechanical drilling hole diameter (mm) | 0.15 |
| 13 | Min. laser drilling hole diameter(mm) | 0.075 |
| 14 | Max. aspect(through hole) | 15:1 |
| Max. aspect(micro-via) | 1.3:1 | |
| 15 | Min. hole edge to copper space(mm) | L≤10, 0.15；L=12-22,0.175；L=24-34, 0.2；L=36-44, 0.25；L＞44, 0.3 |
| 16 | Min. Inner layer clearance(mm) | 0.15 |
| 17 | Min. hole edge to hole edge space(mm) | 0.28 |
| 18 | Min. hole edge to profile line space(mm) | 0.2 |
| 19 | Min. Inner layer copper to profile line space (mm) | 0.2 |
| 20 | Registration tolerance between holes (mm) | ±0.05 |
| 21 | Max. finished copper thickness(um) | Outer Layer: 420 (12oz) Inner Layer: 210 (6oz) |
| 22 | Min. trace width (mm) | 0.075 (3mil) |
| 23 | Min. trace space (mm) | 0.075 (3mil) |
| 24 | Solder mask thickness (um) | line corner : >8 (0.3mil) upon copper: >10 (0.4mil) |
| 25 | ENIG golden thickness (um) | 0.025-0.125 |
| 26 | ENIG nickle thickness (um) | 3-9 |
| 27 | Sterling silver thickness (um) | 0.15-0.75 |
| 28 | Min. HAL tin thickness (um) | 0.75 |
| 29 | Immersion tin thickness (um) | 0.8-1.2 |
| 30 | Hard-thick gold plating gold thickness (um) | 1.27-2.0 |
| 31 | golden finger plating gold thickness (um) | 0.025-1.51 |
| 32 | golden finger plating nickle thickness(um) | 3-15 |
| 33 | flash gold plating gold thickness (um) | 0,025-0.05 |
| 34 | flash gold plating nickle thickness (um) | 3-15 |
| 35 | profile size tolerance (mm) | ±0.08 |
| 36 | Max. solder mask plugging hole size (mm) | 0.7 |
| 37 | BGA pad (mm) | ≥0.25 (HAL or HAL Free:0.35) |
| 38 | V-CUT blade position tolerance (mm) | +/-0.10 |
| 39 | V-CUT position tolerance (mm) | +/-0.10 |
| 40 | Gold finger bevel angle tolerance (o) | +/-5 |
| 41 | Impedance tolerance (%) | +/-5% |
| 42 | Warpage tolerance (%) | 0.75% |
| 43 | Min. legend width (mm) | 0.1 |
| 44 | Fire flame class | 94V-0 |
| Special for Via in pad products | Resin plugged hole size (min.) (mm) | 0.3 |
| Resin plugged hole size (max.) (mm) | 0.75 | |
| Resin plugged board thickness (min.) (mm) | 0.5 | |
| Resin plugged board thickness (max.) (mm) | 3.5 | |
| Resin plugged maximum aspect ratio | 8:1 | |
| Resin plugged minimum hole to hole space (mm) | 0.4 | |
| Can difference hole size in one board? | yes | |
| Max. panel size (finished) (mm) | 880 ×580 | |
| Max. working panel size (mm) | 914 × 602 | |
| Max. board thickness (mm) | 12 | |
| Max. layer-up(L) | 40 | |
| Aspect | 30:1 (Min. hole: 0.4 mm) | |
| Line wide/space (mm) | 0.075/ 0.075 | |
| Back drill capability | Yes | |
| Tolerance of back drill (mm) | ±0.05 | |
| Tolerance of press fit holes (mm) | ±0.05 | |
| Surface treatment type | OSP, sterling silver, ENIG | |
| Rigid-flex board | Hole size (mm) | 0.2 |
| Dielectrical thickness (mm) | 0.025 | |
| Working Panel size (mm) | 350 x 500 | |
| Line wide/space (mm) | 0.075/ 0.075 | |
| Stiffener | Yes | |
| Flex board layers (L) | 8 (4plys of flex board) | |
| Rigid board layers (L) | ≥14 | |
| Surface treatment | All | |
| Flex board in mid or outer layer | Both | |
| Special for HDI products | Laser drilling hole size (mm) | 0.075 |
| Max. dielectric thickness (mm) | 0.15 | |
| Min. dielectric thickness (mm) | 0.05 | |
| Max. aspect | 1.5:1 | |
| Bottom Pad size (under micro-via) (mm) | Hole size+0.15 | |
| Top side Pad size ( on micro-via) (mm) | Hole size+0.15 | |
| Copper filling or not (yes or no) (mm) | yes | |
| Via in Pad design or not ( yes or no) | yes | |
| Buried hole resin plugged (yes or no) | yes | |
| Min. via size can be copper filled (mm) | 0.1 | |
| Max. stack times | 4 | |
Global Success is an Experienced Multilayer PCB Manufacturer
Global Success has been producing Multilayer PCBs for over 13 years. Over the years, we have seen all types of multilayer constructions from various industries, answered all types of multilayer questions, and solved all types of problems with multilayer PCBs.
PCB fabrication advantages from Global Success over other PCB suppliers
