Global Success Circuits Co.,Ltd

Global Success Circuits Co.,Ltd World’s Professional PCB Manufacturer

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OEM 2.5OZ FR4 Electronics PCB Manufacturing 6 Layer LF HASL Surface Treatment

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Global Success Circuits Co.,Ltd
City:shenzhen
Province/State:guangdong
Country/Region:china
Contact Person:MrsRose Guo
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OEM 2.5OZ FR4 Electronics PCB Manufacturing 6 Layer LF HASL Surface Treatment

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Brand Name :Global Success Circuits Co.,Ltd
Model Number :GPC12580
Certification :ISO 9001-2008, ISO TS 16949 ,UL
Place of Origin :China (mainland)
MOQ :1 Piece
Price :US$ 0.3 - 1.3 / Piece
Payment Terms :L/C, D/P, T/T, Western Union
Delivery Time :1 - 15 days
Packaging Details :vacuum package
Material :FR4
Board thickness :2.4MM
Soldermask :Green
Silkscreen :White
Surface treatment :LF HASL
Copper thickness :2.5OZ
Min. grid line width :4MIL
Minimum line width/space :3.5MIL
Impedance control tolerance :+/-8%
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OEM 2.5OZ FR4 Electronics PCB Manufacturing 6 Layer LF HASL Surface Treatment

Number of layers: 6 layers
Material: FR4
Board thickness: 12.4mm
Surface plating: Lead Free HASL
Special process description: 2.5OZ

Solder maskL: Green

Brief introduction of GS:

1. GS are ISO/TS and UL certified.

2. We have 3 factories and more than 1000 employees in China.

3. With very compitive price and high quality, 50% pcb are exported to Europe and America.

4. Our main service cover PCB and PCB assembly..

GS can help your business stay ahead of the competition by improving quality, productivity, and delivery in your supply chain while reducing costs.

Welcome to send inquiry to me for comparing price any time.

PCBA/PCB assembly specifications:

  1. PCB layers: 1 to 18 layers (standard)
  2. PCB materials/types: FR4, aluminum, CEM1, super thin PCB, FPC/gold finger, HDI
  3. Assembly service types: DIP/SMT or mixed SMT and DIP
  4. Copper thickness: 0.5-10oz
  5. Assembly surface finish: HASL, ENIG, OSP, immersion tin, immersion Ag, flash gold
  6. PCB dimensions: 450x1500mm
  7. IC pitch (min): 0.2mm
  8. Chip size (min): 0201
  9. Leg distance (min): 0.3mm
  10. BGA sizes: 8x6/55x55mm
  11. SMT efficiency: SOP/CSP/SSOP/PLCC/QFP/QFN/BGA/FBGA/u-BGA
  12. u-BGA ball diameter: 0.2mm
  13. Required docs for PCBA Gerber file with BOM list and pick-n-place file (XYRS)
  14. SMT speed: chip components SMT speed 0.3S/pieces, max speed 0.16S/pieces

What can we do for you?

  1. EMS-electronic manufacturing service
  2. PCB supply and layout
  3. PCB assembly on SMT, BGA and DIP
  4. Cost effective components sourcing
  5. Fast turn prototype and mass production
  6. Box build assembly
  7. Engineering supported
  8. Tests (X-ray, 3D paste thickness, ICT, AOI and functional tests)

For PCBA order, provide us:

  1. PCB Gerber file
  2. BOM list for PCBA
  3. Sample of PCB and PCBA
  4. Test method for PCBA

Services and applications:

  1. Through hole board assembly
  2. SMT assembly including BGA assembly, smallest placement: 0201
  3. Material procurement
  4. Consigned material management
  5. Plastic or metal enclosure
  6. Complex final assembly
  7. Functional test
  8. Cable assembly
  9. Labeling and packing
  10. Customized logistics per customer
  11. Laser cut framed SMT solder paste stencils
  12. PCB design and schematic capture

PCBA capabilities:

  1. Component height: 0.2-25mm
  2. Min packing: 0201
  3. Min distance from
  4. BGA: 0.25-2.0mm
  5. Min BGA size: 0.1-0.63mm
  6. Min QFP space: 0.35mm
  7. Min assembly size: 50*30mm
  8. Max assembly size: 350*550mm
  9. Pick-placement precision: 0.01mm
  10. Pick-placement range: QFP, SOP, PLCC, BGA
  11. Placement capability: 0805, 0603, 0402, 0201
  12. High-pin count press fit available
  13. SMT capacity per day: 3,200,000 point

Competitive advantages:

  1. No minimum order quantity and free sample
  2. Focus on low to medium volume production
  3. Quick and on-time delivery
  4. International approvals
  5. Great customer service
  6. Diversified shipping method

Item Mass production Small batch production
Number of layers UP TO 18L UP TO L
Laminate type FR-4, halogen free, high TG(Shengyi, KB), Cem-3, PTFE, aluminum based, PTEE, Rogers or more. FR-4, Halogen free, High TG(Shengyi, KB), Cem-3, PTFE, Aluminum based, PTEE, Rogers or more.
Maximum board size 610mm*1100mm 610mm*1100mm
Board thickness 0.1mm-7.00mm <0.1mm and >7.00mm
Minimum line width/space 3.5mil(0.0875mm) 3mil(0.075mm)
Minimum line gap +/-15% +/-10%
Outer layer copper thickness 35um-175um 35um-210um
Inner layer copper thickness 12um-175um 12um-210um
Drilling hole size(Mechanical) 0.15mm-6.5mm 0.15mm-6.5mm
Finished hole size (Mechanical) 0.15mm-6.0mm 0.15mm-6.0mm
Board thickness hole size ratio 14:1 16:1
Board thickness tolerance(t=0.8mm) ±8% ±5%
Board thickness tolerance(t<0.8mm) ±10% ±8%
Min. grid line width 4mil(12, 18, 35um), 6mil(70um) 4mil(12, 18, 35um), 6mil(70um)
Min. grid spacing 6mil(12, 18, 35um), 8mil(70um) 6mil(12, 18, 35um), 8mil(70um)
Hole size tolerance(Mechanical) 0.05-0.075mm 0.05mm
Hole position tolerance(Mechanical) 0.005mm 0.005mm
Solder mask color Green, Blue, Black, White, Yellow, Red, Grey etc. Green, Blue, Black, White, Yellow, Red, Grey etc.
Impedance control tolerance +/-10% +/-8%
Min. distance between drilling to conductor(non-blind buried orifice) 8mil(8L), 9mil(10L), 10mil(14L), 12mil(26L) 6mil(8L), 7mil(10L), 8mil(14L), 12mil(26L)
Min. Character width and height(35um base copper) Line width: 5mil
Height: 27mil
Line width: 5mil; height: 27mil
Max. test voltage 500V 500V
Max. test current 200mA 200mA




Surface treatment
Flash Gold 0.025-0.075um 0.025-0.5um
Immersion Gold 0.05-0.1um 0.1-0.2um
Sn/Pb HASL 1-70um 1-70um
Lead-free HASL 1-70um 1-70um
Immersion Silver 0.08-0.3um 0.08-0.3um
OSP 0.2-0.4um 0.2-0.4um
Gold Finger 0.375um >=1.75um
Hard Gold Plating 0.375um >=1.75um
Immersion Sin 0.8um
V-Cut rest thickness tolerance ±0.1mm ±0.1mm








Outline profile
Chamfer The angle type of the chamfer 30,45,60
Plug via hole Max.size can be plugged 0.6mm
Largest NPTH hole size 6.5mm >6.5mm
Largest PTH hole size 6.5mm >6.5mm
Min. solder spacer ring 0.05mm 0.05mm
Min. solder bridge width 0.1mm 0.1mm
Drilling diameter 0.15mm-0.6mm 0.15mm-0.6mm
Min. pad diameter with hole 14mil( 0.15mm drilling) 12mil( 0.1mm laser)
Min. BGA pad diameter 10mil 8mil
Chemical ENIG gold thickness 0.025-0.1um(1-4U) 0.025-0.1um
Chemical ENIG nickel thickness 3-5um(120-200U) 3-5um
Min. resistance test Ω 5

OEM 2.5OZ FR4 Electronics PCB Manufacturing 6 Layer LF HASL Surface Treatment
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