Global Success Circuits Co.,Ltd
Global Success Circuits Co.,Ltd World’s Professional PCB Manufacturer
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High Temperature Green 1 Oz 4 Layer PCB Board For Medical Control System
Multilayer PCB
Multilayer printed circuit boards (PCBs) represented the next major evolution in fabrication technology. From the base platform of double sided plated thru came a very sophisticated and complex methodology that would again allow circuit board designers a dynamic range of interconnects and applications. Multilayer circuit boards were essential in the advancement of modern computing. The multilayer PCB basic construction and fabrication are similar to micro chip fabrication on a macro size. The range of material combinations is extensive from basic epoxy glass to exotic ceramic fills. Multilayer can be built on ceramic, copper, and aluminum. Blind and buried vias are commonly produced, along with pad on via technology. Manufacturing multilayer circuit boards is a straightforward process but does require a high level of attention to detail. PCB Manufacturing multilayer PCBs requires a specialized hydraulic press with heated platens.
The multilayer PCB is made up by two or more pcbs which are stacked together with reliable predefined mutual connection between them. There are at least three conductive layers in one multilayer PCB with two layers outside and the one layer synthesized in the insulation board. Due to the complex manufacturing process and lower production , the cost of multilayer pcb is relatively higher. Multi-layer PCB needs further design attention as we have to keep some points into consideration from manufacturing perspective:
• Copper areas – on inner layers, all copper should be kept at least and largest value.
• Via clearance through inner layers (antipads)
• Allow for clearance around any holes or via barrels not connected to an inner layer. This clearance should be at least 15 mil although 20 mil clearance is preferred.
• Thermal Relief Pads – the tie should be a minimum of 8 mil while more is preferable.
• Larger geometries – will result in higher yields which will be reflected in your board price.
| Category | Description | Capability |
| Laminate Material | FR4, High TG FR4(tg150,tg170,tg180) Halogen-free FR4, CEM1, CEM3,Polyimide, Rogers ,Aluminum | We will order other special material accoprding to your request |
| Board Layers | Maximum layers | 1-18layers |
| Size | Maximum finished dimensions | 500*1200mm |
| Board Thickness | Minimum and Maximum | 0.2-3.2mm |
| Copper | Outer copper weight | 0.5oz (17um) - 4oz (140um) |
| Inner copper weight | 0.5oz (17um) - 4 oz (105um) | |
| Drilling | Minimum drilling size | 0.15mm |
| Drill Deviation (True position size) | 2mil (0.050mm) | |
| PTH hole tolerance | 3mil (0.075mm) | |
| N-PTH hole tolerance | 2mil (0.050mm) | |
| Minimum hole wall thickness | 20um | |
| Angle of Countersink | 80°, 90°, 100°, 120° | |
| Circuit line | Minimum width | 0.1mm/ 4mil |
| Minimum space | 0.1mm/ 4mil | |
| Inner Layers | Minimum space from drilling to inner pattern | 6mil (0.15mm) |
| Minimum space from annular ring to inner pattern | 6mil (0.15mm) | |
| Layer-to-layer registration | 3mil (0.08mm) | |
| Board Profilling | Hole to board edge tolerance | ±4mil (0.1mm) |
| Pattern to board edge tolerance | ±4mil (0.1mm) | |
| CNC Tolerance | ±4mil (0.1mm) | |
| Minmum thickness after V-Cut | 12mil (0.3mm) | |
| V-Cut tolerance | ±5mil (0.12mm) | |
| V-Cut Angle | 20,30,45,60 | |
| Solder mask | Color | green, light green, matte green, white black,matte black,yellow,red, blue |
| Thickness | ≥17um | |
| Silkscreen | Color | White, black, yellow, red, blue, green, gray |
| Minimum line height | ≥0.0625mm | |
| Minimum line width | ≥0.125mm | |
| Surface Finish | HASL, HASL pb free, immersion gold, immersion silver, O.S.P | |
| Certification | IPC-A-600 Class II/III, UL E324220, ISO 9001,ISO/TS16949, ROHS | |
1. Quick turn: 12 hours for 1 layer, 24 hours for 2 layers and 2-5 days for multilayer.
2. High-tech products including high Tg, high frequency, heavy copper, metal substrate, hybrid, halogen free, micro via, mix-material, backplane, and rigid-flex.
3. Advanced manufacturing and inspection equipment from USA, Japan, Germany and Taiwan.
4. 1-18 layers of rigid PCB, 1-8 layers of FPC, and 1-18 layers of rigid-flex PCB with ENIG, LF HAL, gold finger, immersion silver/tin, OSP, thick gold.
