Global Success Circuits Co.,Ltd
Global Success Circuits Co.,Ltd World’s Professional PCB Manufacturer
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Lead Free HASL Four Layer Custom Printed Circuit Board 1.6mm Thickness
Name: Coffee machine board
Number of layers: 4 layers
Material: FR4
Board thickness: 1.6mm
Surface plating: ENIG
Special process description: NO
Who We Are
Established in 2005, Global Success is a professional manufacturer of PCB & PCBA and EMS (electronics manufacturing service) with nearly 15-year experience PCB Fabrication, PCB Assembly, PCBA Prototype, PCBA Test, Electronic Part Sourcing and EMS for kinds of smart electronic manufacturing.
SMT Processing
Now we have 9 SMT Lines and 3 DIP Lines to perform PCB assembly. The precision of chip replacement is up to +0.1MM, this indicates we have professional skills in producing all kinds of printed integrated circuit boards such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA with surface-mount technology (SMT), thru-hole technology (THT) and merged tech components.
DIP Processing
Global Success has three DIP processing lines, professional working platforms and carriers, this ensures a output capacity of 1 500 000pcs per day. For every process, technical and standard
Just-in-time logistics and delivery are crucial for today's PCB manufacturers. GS can help your business stay ahead of the competition by improving quality, productivity, and delivery in your supply chain while reducing costs.
Give us a try with your next quote. You will be glad you did.
Many users have experienced to buy "cheap" is not always the best solution, but you will not be disappointed with us, we prefer to lose an order than to lose a customer!
| Item | Mass production | Small batch production | ||
| Number of layers | UP TO 18L | UP TO L | ||
| Laminate type | FR-4, halogen free, high TG(Shengyi, KB), Cem-3, PTFE, aluminum based, PTEE, Rogers or more. | FR-4, Halogen free, High TG(Shengyi, KB), Cem-3, PTFE, Aluminum based, PTEE, Rogers or more. | ||
| Maximum board size | 610mm*1100mm | 610mm*1100mm | ||
| Board thickness | 0.1mm-7.00mm | ＜0.1mm and ＞7.00mm | ||
| Minimum line width/space | 3.5mil(0.0875mm) | 3mil(0.075mm) | ||
| Minimum line gap | +/-15% | +/-10% | ||
| Outer layer copper thickness | 35um-175um | 35um-210um | ||
| Inner layer copper thickness | 12um-175um | 12um-210um | ||
| Drilling hole size(Mechanical) | 0.15mm-6.5mm | 0.15mm-6.5mm | ||
| Finished hole size (Mechanical) | 0.15mm-6.0mm | 0.15mm-6.0mm | ||
| Board thickness hole size ratio | 14:1 | 16:1 | ||
| Board thickness tolerance(t=0.8mm) | ±8% | ±5% | ||
| Board thickness tolerance(t＜0.8mm) | ±10% | ±8% | ||
| Min. grid line width | 4mil(12, 18, 35um), 6mil(70um) | 4mil(12, 18, 35um), 6mil(70um) | ||
| Min. grid spacing | 6mil(12, 18, 35um), 8mil(70um) | 6mil(12, 18, 35um), 8mil(70um) | ||
| Hole size tolerance(Mechanical) | 0.05-0.075mm | 0.05mm | ||
| Hole position tolerance(Mechanical) | 0.005mm | 0.005mm | ||
| Solder mask color | Green, Blue, Black, White, Yellow, Red, Grey etc. | Green, Blue, Black, White, Yellow, Red, Grey etc. | ||
| Impedance control tolerance | +/-10% | +/-8% | ||
| Min. distance between drilling to conductor(non-blind buried orifice) | 8mil(8L), 9mil(10L), 10mil(14L), 12mil(26L) | 6mil(8L), 7mil(10L), 8mil(14L), 12mil(26L) | ||
| Min. Character width and height(35um base copper) | Line width: 5mil Height: 27mil | Line width: 5mil; height: 27mil | ||
| Max. test voltage | 500V | 500V | ||
| Max. test current | 200mA | 200mA | ||
Surface treatment | Flash Gold | 0.025-0.075um | 0.025-0.5um | |
| Immersion Gold | 0.05-0.1um | 0.1-0.2um | ||
| Sn/Pb HASL | 1-70um | 1-70um | ||
| Lead-free HASL | 1-70um | 1-70um | ||
| Immersion Silver | 0.08-0.3um | 0.08-0.3um | ||
| OSP | 0.2-0.4um | 0.2-0.4um | ||
| Gold Finger | 0.375um | >=1.75um | ||
| Hard Gold Plating | 0.375um | >=1.75um | ||
| Immersion Sin | 0.8um | |||
| V-Cut rest thickness tolerance | ±0.1mm | ±0.1mm | ||
Outline profile | Chamfer | The angle type of the chamfer | 30,45,60 | |
| Plug via hole | Max.size can be plugged | 0.6mm | ||
| Largest NPTH hole size | 6.5mm | >6.5mm | ||
| Largest PTH hole size | 6.5mm | >6.5mm | ||
| Min. solder spacer ring | 0.05mm | 0.05mm | ||
| Min. solder bridge width | 0.1mm | 0.1mm | ||
| Drilling diameter | 0.15mm-0.6mm | 0.15mm-0.6mm | ||
| Min. pad diameter with hole | 14mil( 0.15mm drilling) | 12mil( 0.1mm laser) | ||
| Min. BGA pad diameter | 10mil | 8mil | ||
| Chemical ENIG gold thickness | 0.025-0.1um(1-4U) | 0.025-0.1um | ||
| Chemical ENIG nickel thickness | 3-5um(120-200U) | 3-5um | ||
| Min. resistance test | Ω | 5 | ||
Quality ASSURANCE:
Global Circuits is ISO 9001:2008 certified.
Our dedication to building a quality product is the centerpiece of our business policy.
We are committed to fulfilling our customers' on-going quality requirements through continuous improvements to all of our internal processes. Our quality management system ensures the highest operating standards at all levels.
Quality System Standards
ISO 9001:2008 certified.
Acceptability Criteria
IPC-A-600 (Latest Revision) class 2 and 3
Performance Specification
IPC-A-6012 (Latest Revision) class 2 and 3.
UL 796,94V-0
