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ENIG TG180 4 Layer PCB Board Red Soldermask PCB Fabrication Service
About Global Success Circuits :
What can we do for you?
EMS-electronic manufacturing service
PCB supply and layout
PCB assembly on SMT, BGA and DIP
Cost effective components sourcing
Fast turn prototype and mass production
Box build assembly
Engineering supported
Tests (X-ray, 3D paste thickness, ICT, AOI and functional tests)
PROCESS CAPABILITY | |||
LAYERS | 1-18 | MIN BOARD THICKNESS(Double sided) | 0.3mm |
MAX PANEL SIZE | 635×1120mm | MIN BOARD THICKNESS(Multi layer) | 0.4mm |
MAX THICKNESS | 6OZ | MIN INNER THICKNESS | 0.1mm |
MIN WIDTH | 0.1mm |
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MIN SPACING | 0.1mm | MIN HOLE TOLERANCE | ±0.075mm |
MIN HOLE | 0.20mm (aspect ratio10:1) | MIN HOLE TOLERANCE | ±0.075mm |
CAMBER | ≤ 0.75% | MIN OUTLINE TOLERANCE | ±0.10mm |
IMPEDANCE TOLERANCE | +/-10% | GRAPHICS ALIGNMENT TOLERANCE | ±/0.075mm |
HOLE COPPER THICKNESS | 25um | ||
SURFACE TEATMENT | LEAD FREE HASL,HASL,IMMERSION GOLD,GOLD FINGER,OSP... | ||
MATIRIAL | FR-4, HIGH TG FR-4, THICK COPPER FR-4, ALUMINUM BASE | ||
DELIVERY TIME | DOUBLE SIDED SAMPLE-5 DAY,FOUR LAYER SAMPLE-7 DAY |
Supported Assembly Capabilities
Different types of Assembly
° THD (Thru-Hole Device)
° SMT (Surface-Mount Technology)
° SMT & THD combined
° 2-sided SMT and THD assembly
Order Volume Allowed
° 1 to 5,000 boards
Parts
° Passives parts, smallest size 0201
° Fine pitch to 8 Mils
° BGA, uBGA, QFN, POP and Zero-Lead chips
° Connectors and terminals
Component Package
° Reels
° Cut tape
° Tube and tray
° Loose parts and bulk
PCB Board Measurements
° Minimum measurement: 0.2″ x 0.2″ (5mm x 5mm)
° Largest dimension: 15″ x 20″ (381mm x 508mm)
Printed circuit board shapes
° Oblong
° Round
° Slots and Cut outs
° Complicated and Uncommon
PCB board kinds
° Rigid FR-4 boards
° Rigid-Flex boards
Assy procedures
° Leaded process
° Zero-Lead (RoHS)
Design file formatting
° Gerber RS-274X, 274D, Eagle as well as AutoCAD’s DXF, DWG
° BOM (Bill of Materials) (.xls, .csv, . xlsx)
° Centroid (Pick-N-Place Or XY file)