Global Success Circuits Co.,Ltd
Global Success Circuits Co.,Ltd World’s Professional PCB Manufacturer
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Small Size Green Mask Electronic Control Board Two Sided PCB 3 OZ Copper Thickess
Number of layers: 2 layers
Material: FR4
Board thickness: 1.6mm
Surface plating: ENIG
Special process description: 1OZ
TG value: 180
Please call GSC if you need:
Fast turn-around prototypes.
Low-Medium-High volume production requirements.
To meet your prodution schedules.
On time delivery with a quality product.
A competitive price
PROTOTYPE AND VOLUME PRODUCTION:
Single sided
Double sided
Multilayer up to 8 layers
Immersion white tin process
About 1000 workers, 50000 ㎡ workshop, 13 years experience, 10 years' of exporting, ISO, TS & SGS certificated, 3 factories located in Shenzhen, Jiangxi and Jiangsu, this is how we keep superior quality and competitive offers for global valued customers.
Services and applications:
PCBA capabilities:
Competitive advantages:
| Materials | Standard | Advanced |
| FR4 (130‐180 Tg by DSC) | Y | Y |
| Halogen Free | Y | Y |
| BT Epoxy | Y | Y |
| Getek | Y | Y |
| Isola 370HR 406 408 IS410 IS 420 IS620 | Y | Y |
| Nelco 4000 | Y | Y |
| Rogers 4000 | Y | Y |
| PTFE | Y | Y |
| Dupont Pyralux | N | Y |
| Aluminum Core | Y | Y |
| Surface Finishes | ||
| ENIG | Y | Y |
| Flash Gold | Y | Y |
| Electrolytic Nickel/Hard Gold | Y | Y |
| HASL | Y | Y |
| Lead Free HASL | Y | Y |
| Immersion Ag | Y | Y |
| Standard Features | Standard | Advanced |
| Maximum layer count | 20 | 36 |
| Maximum Panel Size | 21″x24″ | 24″x30″ |
| Outer Layer Trace/Spacing (1/3 oz) | 0.0035″/0.0035″[90μm/90μm] | 0.0025″/0.003″[64μm/76μm] |
| Inner Layer Trace/Spacing (H oz) | 0.003″/0.003″ [76μm/76μm] | 0.002″/0.0025″ [50μm/64μm] |
| Maximum PCB thickness | 0.125″[3.2mm] | 0.177″[4.5mm] |
| Minimum PCB thickness | 0.008″[0.20mm] | 0.004″[0.10mm] |
| Minimum mechancial drill size | 0.008″[0.20mm] | 0.004″[0.10mm] |
| Maximum PCB aspect ration | 10:01 | 12:01 |
| Maximum copper weight | 5 oz [178μm] | 6 oz [214μm] |
| Minimum copper weight | 1/3 oz [12μm] | 1/4 oz [9μm] |
| Minimum core thickness | 0.002″[50μm] | 0.0015″[38μm] |
| Minimum dielectric thickness | 0.0025″[64μm] | 0.0015″[38μm] |
| Minimum Pad Size over Drill | 0.018″[0.46mm] | 0.016″[0.4mm] |
| Solder Mask Registration | +/‐ 0.002″[50μm] | +/‐ 0.0015″[38μm] |
| Mimimum Solder Mask Dam | 0.003″[76μm] | 0.0025″[64μm] |
| Copper feature to PCB edge | 0.015″[0.38mm] | 0.010″[0.25mm] |
| Tolerance on overall dimensions | +/‐ 0.004″[100μm] | +/‐ 0.002″[50μm] |
| HDI Features | ||
| Immersion Tin | Y | Y |